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3Dn-Tabletop
nScrypt
Product data validated by the manufacturer.
| Technology | Material Extrusion, Material Jetting |
| Materials | Ceramic, Metal, Polymers, Others |
| Feedstock format | Filament, Liquid, Paste |
| Build envelope | 150 × 150 × 100 mm |
| Country | United States |
Price
Approximate starting prices based on supplier-provided information and public data. Prices may vary by region, over time and do not include additional products or services (taxes, shipping, accessories, training, installation, ...).
upon request
Description
nScrypt 3Dn-Tabletop overview
The 3Dn-Tabletop is a 3D printer produced by nScrypt, a manufacturer based in the United States.
It uses the Fused Filament Fabrication, Material jetting (thermally-bonded), Material jetting (UV-cured) and Additively Manufactured Electronics technologies to produce alumina, clay, bronze, gold, magnesium, copper, silver, elastomers, thermoplastics, thermosets, bio/organic and electronics/PCB parts using filament, liquid and paste feedstocks.
It offers a build volume of 150 × 150 × 100 mm.
nScrypt 3Dn-Tabletop price
Please contact us to get a quote.
Technical specifications
General |
|
|---|---|
| Model | 3Dn-Tabletop |
| Brand | nScrypt |
| Price Approximate starting prices based on supplier-provided information and public data. Prices may vary by region, over time and do not include additional products or services (taxes, shipping, accessories, training, installation, ...). | upon request |
| Country | United States |
| Status | Available |
| Release date | 2019 |
| Topics | Ceramic, Clay, Composite AM, Electronics, Full color, High-performance, Hybrid, Metal AM |
| Certifications | CE, UL |
Performance |
|
|---|---|
| Build envelope | 150 × 150 × 100 mm |
| Build volume | 2.25 L |
| Max. resolution (XY) | 0.01 mm |
| Max. resolution (Z) | 0.006 mm |
| Max. build rate | - |
| Max. chamber temp. | - |
| Full color | |
Technology |
|
|---|---|
| Process | Material Extrusion (MEX) |
| Technology | Thermally-bonded > Fused Filament Fabrication (FFF) |
| Max. print speed | 300 mm/s |
| Max. deposition rate | - |
| Filament diameter(s) | 1.75 mm |
| Max. build plate temp. | 60 °C |
| Number of extruders | 4 |
| Max. extruder temp. | 400 °C |
| Independent Dual Extruder (IDEX) | - |
| Nozzle diameter(s) | 0.2 mm |
| Process | Material Jetting (MJT) |
| Technology | Thermally-bonded > Material jetting (thermally-bonded) |
| Technology | UV-cured > Material jetting (UV-cured) |
| Technology | UV-cured > Additively Manufactured Electronics (AME) |
| Resolution (dpi) | - |
Materials |
|
|---|---|
| Feedstock format | Filament, Liquid, Paste |
| Materials | Ceramic |
| Alumina | |
| Clay | |
| Metal | |
| Bronze | |
| Gold | |
| Magnesium | |
| Copper | |
| Cu | |
| Silver | |
| Sterling silver 925 | |
| Silver (others) | |
| Polymers | |
| Elastomers | |
| Thermoplastic elastomers: TPE, TPU | |
| Thermoplastics | |
| PLA | |
| PVA | |
| Polyaryletherketone: PEEK, PEEK-CF, PEKK, PEKK-CF, PAEK (others) | |
| Polycarbonates: PC, PC-ABS, PC-ASA, Polycarbonate (others) | |
| Polyesters: PCTG, PET, PETG, Polyester (others) | |
| Polyimides: TPI, ULTEM 1010 (PEI), ULTEM 9085 (PEI), Polyimides (others) | |
| Polysulfones: PPSU/PPSF, PSU | |
| Styrenes: ABS | |
| Thermosets | |
| Photopolymers: Wax, Photopolymers (others) | |
| Others | |
| Bio/organic | |
| Electronics/PCB | |
Applications |
|
|---|---|
| Industries | - |
Hardware |
|
|---|---|
| Dimensions | 970 × 920 × 1220 mm |
| Weight | 227 kg |
| Axes | 4 |
| Hybrid manufacturing | |
| Robotic arm | - |
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Approximate starting prices based on supplier-provided information and public data. Prices may vary by region, over time and do not include additional products or services (taxes, shipping, accessories, training, installation, ...).
upon request
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Approximate starting prices based on supplier-provided information and public data. Prices may vary by region, over time and do not include additional products or services (taxes, shipping, accessories, training, installation, ...).
upon request
