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3Dx-700
nScrypt
Product data validated by the manufacturer.
| Technology | Material Extrusion, Material Jetting |
| Materials | Metal, Polymers, Others |
| Feedstock format | Filament, Paste |
| Build envelope | 1803 × 1626 × 1931 mm |
| Country | United States |
Price
Approximate starting prices based on supplier-provided information and public data. Prices may vary by region, over time and do not include additional products or services (taxes, shipping, accessories, training, installation, ...).
upon request
Description
nScrypt 3Dx-700 overview
The 3Dx-700 is a 3D printer produced by nScrypt, a manufacturer based in the United States.
It uses the Fused Filament Fabrication, Fused Deposition Modeling, Paste deposition, Gel Dispensing Printing, NanoParticle Jetting™, Material jetting (UV-cured) and Additively Manufactured Electronics technologies to produce bronze, gold, magnesium, copper, silver, elastomers, thermoplastics, thermosets and electronics/PCB parts using filament and paste feedstocks.
It offers a build volume of 1803 × 1626 × 1931 mm.
nScrypt 3Dx-700 price
Please contact us to get a quote.
Technical specifications
General |
|
|---|---|
| Model | 3Dx-700 |
| Brand | nScrypt |
| Price Approximate starting prices based on supplier-provided information and public data. Prices may vary by region, over time and do not include additional products or services (taxes, shipping, accessories, training, installation, ...). | upon request |
| Country | United States |
| Status | Available |
| Release date | 2019 |
| Topics | Composite AM, Electronics, High-performance, Hybrid, Large format, Metal AM, Robotic AM, Silicone |
| Certifications | CE |
Performance |
|
|---|---|
| Build envelope | 1803 × 1626 × 1931 mm |
| Build volume | 5661.07 L |
| Max. resolution (XY) | 0.0025 mm |
| Max. resolution (Z) | 0.003 mm |
| Max. build rate | - |
| Max. chamber temp. | - |
| Full color | - |
Technology |
|
|---|---|
| Process | Material Extrusion (MEX) |
| Technology | Thermally-bonded > Fused Filament Fabrication (FFF) |
| Technology | Thermally-bonded > Fused Deposition Modeling (FDM) |
| Technology | Chemically-bonded > Paste deposition |
| Technology | Chemically-bonded > Gel Dispensing Printing (GDP) |
| Max. print speed | 500 mm/s |
| Max. deposition rate | - |
| Filament diameter(s) | 1.75 mm |
| Max. build plate temp. | - |
| Number of extruders | 8 |
| Max. extruder temp. | 350 °C |
| Independent Dual Extruder (IDEX) | |
| Nozzle diameter(s) | 0.25 mm |
| Process | Material Jetting (MJT) |
| Technology | Thermally-bonded > NanoParticle Jetting™ (NPJ) |
| Technology | UV-cured > Material jetting (UV-cured) |
| Technology | UV-cured > Additively Manufactured Electronics (AME) |
| Resolution (dpi) | - |
Materials |
|
|---|---|
| Feedstock format | Filament, Paste |
| Materials | Metal |
| Bronze | |
| Gold | |
| Magnesium | |
| Copper | |
| Cu | |
| CuCP | |
| Silver | |
| Sterling silver 925 | |
| Silver (others) | |
| Polymers | |
| Elastomers | |
| Silicones | |
| Thermoplastic elastomers: TPE, TPU | |
| Thermoplastics | |
| PLA | |
| Polyamides | |
| Polyaryletherketone: PEEK, PEEK-CF, PEKK, PEKK-CF, PAEK (others) | |
| Polycarbonates: PC, PC-ABS, Polycarbonate (others) | |
| Polyesters: PCTG, PET, PETG, Polyester (others) | |
| Polyimides: TPI, ULTEM 1010 (PEI), ULTEM 9085 (PEI), Polyimides (others) | |
| Polysulfones: PES, PPSU/PPSF, PSU, Polysulfones (others) | |
| Styrenes: ABS, ASA | |
| Thermosets | |
| Photopolymers: Wax, Photopolymers (others) | |
| Others | |
| Electronics/PCB | |
Applications |
|
|---|---|
| Industries | Aerospace and Space, Automotive and Transports, Consumer goods, Defense and Military, Electronics |
Hardware |
|
|---|---|
| Dimensions | 1803 × 1626 × 1930 mm |
| Weight | 2948 kg |
| Axes | 6 |
| Hybrid manufacturing | |
| Robotic arm | |
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